EP3SL50F780I4L vs EP3SL70F780I4LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I4L sa pamamagitan ng Intel at EP3SL70F780I4LG sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780I4L EP3SL70F780I4LG
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Stratix III L Stratix III L
Logic Elements 47,500 67,500 LE
Embedded Memory (bits) 2,184,192 —
User I/O Count 488 —
I/O Banks 8 —
Packhaging 780-BBGA, FCBGA (29 mm) —
Process Technology 65 nm CMOS 40 nm
Core Voltage 0.9 V 1.1 V
Temperature na Operasyon -40C to +100C (Industrial) -40C to +100C (Industrial, I4)
Lead-Free / RoHS Yes (L suffix) —
Speed Grade I4 —
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Configuration Memory SRAM-based, volatile —
Design Suite Quartus II / Quartus Prime (Stratix III support) —
Device Sub-Family Low-Power (L) —
Country of Origin [DATA_NEEDED: COO not specified in source data] —
Adaptive Logic Modules (ALMs) — 27,000 ALM
Embedded Memory — 2.57 Mbit
Number of I/Os — 488 I/O
Package Type — 780-BBGA, FCBGA (Flip-Chip)
Style ng Pagpapasok — SMD/SMT
Number of Logic Array Blocks (LABs) — 2700
Total Block RAM Bits — 2,699,264 bits
DSP Blocks — Present (refer to device handbook)
Tindminan RoHS — Compliant
Ordering Code Suffix 'G' — Indicates Flip-Chip BGA package

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