EP3SL70F780C4G vs EP3SL70F780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C4G sa pamamagitan ng Intel at EP3SL70F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F780C4G EP3SL70F780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III L —
Logic Elements (LE) 67,500 67,500
Adaptive Logic Modules (ALM) 27,000 —
Embedded Memory 2,699,264 bits (2.57 Mbit) —
Maximum User I/O 488 488
Packhaging 780-ball FCBGA (Flip-Chip BGA) —
Operating Supply Voltage (Core) 1.1 V —
Speed Grade C4 (commercial) C4
Hanay ng Temperature na Operasyon 0C to +85C (Commercial) —
Uri ng Pagpapasok Surface Mount (SMD/SMT) Surface Mount (BGA)
Process Node 40 nm TSMC low-power —
Number of PLLs 8 —
DSP Multipliers (18x18) [DATA_NEEDED: DSP block count] —
Configuration Modes PS, FPP, AS, JTAG —
Tindminan RoHS Compliant —
Level ng MSL 3 —
Manufacturer — Intel (formerly Altera)
Series — Stratix III L
Device Type — FPGA - Field Programmable Gate Array
Total Memory Bits — 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) — 2,700
Process Technology — 65 nm
Internal Frequency (max) — [DATA_NEEDED: internal frequency]
Core Voltage (VCC) — 0.9 V
Temperature na Operasyon — 0C to 85C (commercial)
Package Type — 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS — Yes (lead-free per BGA package)
Configuration Method — JTAG, Passive Serial, FPP, external memory
Design Software — Quartus II (Stratix III device support)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita