EP3SL70F780I3G vs EP3SL70F780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3G sa pamamagitan ng Intel at EP3SL70F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F780I3G EP3SL70F780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III L Stratix III L
Logic Elements (LE) 67,500 —
Adaptive Logic Modules (ALM) 27,000 ALM —
Embedded Memory 2,699,264 bits (2.57 Mbit) —
User I/Os 488 —
Packhaging 780-BBGA, FCBGA (29x29 mm) 780-ball FineLine BGA (FC-FBGA), 28x28 mm
Uri ng Pagpapasok Surface Mount Surface Mount
Core Voltage (VCCINT) 1.1 V —
Temperature na Operasyon -40C to +100C (Industrial) -40 C to +100 C (Industrial)
Process Technology 40 nm TSMC —
Uri ng Memory SRAM-based, external configuration —
DSP Blocks Multipliers, count varies by die —
Configuration External (EPCS / JTAG) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Packaging Tray —
Speed Grade 3 (Medium) I3 (industrial)
Logic Elements — 67,500
Embedded Memory Bits — 2,699,264 bits
Maximum User I/O — 488
Core Voltage — 1.1 V
Process Node — 65 nm
Package Code — BGA780,28X28,40
Configuration Mode — JTAG IEEE 1149.1, Passive Serial, Active Serial
Number of Terminals — 780
Supplier Device Package — 780-BBGA, FCBGA

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