EP4CE55F23I8L vs EP4CE55F29I8L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23I8L sa pamamagitan ng Intel at EP4CE55F29I8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE55F23I8L EP4CE55F29I8L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone IV E —
Logic Elements (LEs) 55,856 —
Embedded Memory Bits 2,396,160 bits (~234 Kbit / ~292.5 KByte) 2,396,160 bits
Maximum User I/O Pins 324 —
Embedded 18x18 Multipliers 156 156
General-Purpose PLLs 4 —
Process Technology 60 nm 60 nm low-power
Core Supply Voltage 1.2 V —
Packhaging 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) 780-FBGA (FineLine BGA), 29x29 mm
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) —
Configuration Modes AS, PS, JTAG Passive Serial, Fast Passive Parallel, Active Serial, JTAG
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X —
Speed Grade 8 8
Tindminan RoHS Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes —
Family — Cyclone IV E
Device Logic Elements — 55,856
Maximum User I/Os — 374
PLLs — 4
Global Clock Networks — 20
Logic Array Blocks (LABs) — 3,435
Core Voltage VCCINT — 1.0 V / 1.2 V
Auxiliary Voltage VCCAUX — 2.5 V
I/O Voltage VCCIO — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Operating Temperature (Industrial) — -40C to +100C junction
Uri ng Pagpapasok — Surface Mount (BGA)

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