EP4CE55F23I8L vs EP4CE75F23I8L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23I8L sa pamamagitan ng Intel at EP4CE75F23I8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE55F23I8L EP4CE75F23I8L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone IV E —
Logic Elements (LEs) 55,856 —
Embedded Memory Bits 2,396,160 bits (~234 Kbit / ~292.5 KByte) —
Maximum User I/O Pins 324 —
Embedded 18x18 Multipliers 156 274
General-Purpose PLLs 4 —
Process Technology 60 nm —
Core Supply Voltage 1.2 V —
Packhaging 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) 484-ball FBGA
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) —
Configuration Modes AS, PS, JTAG AS, PS, FPP, JTAG
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL
Speed Grade 8 —
Tindminan RoHS Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes —
Family — Cyclone IV E
Logic Elements — 75,408
Embedded Memory (bits) — 2,810,880
Number of M9K Memory Blocks — 305
User I/O Pins — 292
PLLs — 4
Global Clock Networks — 20
Maximum User I/O — 292
Temperature na Operasyon — -40C to +85C (Industrial)
Supply Voltage (Core) — 1.0 V / 1.2 V
Process Node — 60 nm low-leakage
Level ng MSL — 3
Uri ng Pagpapasok — Surface Mount (BGA)

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