EP4CE55F29C8L vs EP4CE55F23C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29C8L sa pamamagitan ng Intel at EP4CE55F23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29C8L | EP4CE55F23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | 55,856 LE |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K Blocks) | 260 blocks | — |
| Embedded 18x18 Multipliers | 156 | — |
| Maximum User I/O Pins | 374 | 324 |
| PLLs | 4 | 4 general-purpose |
| Global Clock Networks | 20 | 20 |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm (low-power) | 60 nm low-power CMOS |
| Packhaging | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch | 484-ball FBGA (F23) |
| Speed Grade | C8 (commercial, 8 speed bin) | 8 (Commercial) |
| Temperature na Operasyon | 0C to +85C (commercial, 'L' suffix) | 0 C to +85 C (Commercial, C8) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (Pb-free) |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| JTAG (IEEE 1149.1) | Supported | — |
| Configuration Memory | SRAM-based (external flash required) | — |
| Embedded Memory | — | 2,340 Kbit (M9K blocks) |
| Embedded Multipliers | — | 156 (18x18) |
| Lead-Free Finish | — | Yes (N suffix) |