EP4CE55F29C9LN vs EP4CE55F29I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29C9LN sa pamamagitan ng Intel at EP4CE55F29I8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE55F29C9LN EP4CE55F29I8N
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV E —
Logic Elements (LE) 55,856 —
Embedded Memory 2,396,160 bits —
Embedded 18x18 Multipliers 374 374
Logic Array Blocks (LAB) 3,491 —
M9K Memory Blocks 260 —
PLLs 4 —
Maximum User I/O Pins 374 [DATA_NEEDED: maximum user I/O count for F29 package]
Technology Node 60 nm —
Core Voltage (VCCINT) 1.2 V —
Temperature ng Junction na Operasyon 0 °C to 85 °C (commercial) —
Packhaging 780-ball FBGA (F29) 780-ball FBGA (F29, 29x29 mm)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Lead-Free / RoHS Yes (Pb-free terminal finish, suffix 'N') —
Speed Grade C9 —
Series — Cyclone IV E
Logic Elements (LEs) — 55,856
Embedded Memory (bits) — 2,396,160
General-Purpose PLLs — 4
Process Technology — 60 nm low-power CMOS
Temperature na Operasyon — -40C to +100C (Industrial grade, suffix I)
Supply Voltage Core — 1.0 V (typical, VCCINT)
I/O Bank Supply Voltages — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Configuration Modes — Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP)
External Memory Interfaces — DDR, DDR2, SDR, QDRII, QDRII+ SRAM
Differential I/O Standards — LVDS, RSDS, mini-LVDS, LVPECL (receive)
Tindminan RoHS — Compliant

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