EP4CE55F29I7N vs EP4CE75F29I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29I7N sa pamamagitan ng Intel at EP4CE75F29I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29I7N | EP4CE75F29I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 75,408 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | — |
| Packhaging | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | I7 (industrial) | — |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | 60 nm low-k |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supply Type | Tray | — |
| Embedded Memory (bits) | — | 2,810,880 |
| Logic Array Blocks (LAB) | — | 4,633 |
| Embedded 18x18 Multipliers | — | 426 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Maximum User I/O Pins | — | 426 |
| I/O Banks | — | 8 |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Core Voltage | — | 1.2 V |