EP4CE55F29I8LN vs EP4CE55F29C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29I8LN sa pamamagitan ng Intel at EP4CE55F29C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29I8LN | EP4CE55F29C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone IV E | Cyclone IV E |
| Device Model | EP4CE55 | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,135 | 3,491 |
| Total Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks | — |
| 18x18 Hardware Multipliers | 374 | — |
| PLLs | 4 | 4 to 8 (per device) |
| Maximum User I/O Pins | 374 | 374 |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm TSMC low-power | 60 nm (TSMC low-power) |
| Packhaging | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Ball Pitch | 1.0 mm | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (per OPN suffix N) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Speed Grade | — | 8 (commercial) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Tindminan RoHS | — | Compliant |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |