EP4CGX110CF23C8N vs EP4CGX110DF31C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110CF23C8N sa pamamagitan ng Intel at EP4CGX110DF31C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX110CF23C8N EP4CGX110DF31C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV GX Cyclone IV GX
Logic Elements 109,424 109,424
Logic Array Blocks (LABs) 6,839 6,839
Embedded Memory (bits) 5,621,760 —
User I/O Count 270 —
Transceivers 4 channels 8 high-speed transceivers up to 3.125 Gbps
Transceiver Data Rate (max) 3.125 Gbps —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Process Node 60 nm —
Core Voltage 1.2 V —
Speed Grade C8 8
Temperature na Operasyon 0 C to 85 C (commercial) —
Packhaging 484-ball FBGA (F23) 896-ball FineLine BGA (F31), 31 mm
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Level ng MSL 3 —
Configuration Method Quartus Prime / JTAG / Active Serial —
Embedded Memory Bits — 5,621,760 (approximately 702 Kbits)
Embedded Memory Blocks — M9K blocks, 9-bit parity
DSP Blocks (18x18 Multipliers) — 264 multipliers
Maximum User I/Os — 475
I/O Banks — 8
PLLs — 4 general-purpose PLLs
PCI Express Hard IP — PCIe Gen1/Gen2 x1/x2/x4
Core Supply Voltage — 1.2 V
Process Technology — 60 nm low-power CMOS
Operating Temperature (Commercial) — 0C to 85C
Configuration — SRAM-based, supports AS, PS, JTAG, FPP

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