EP4CGX110DF23I7N vs EP4CGX110CF23I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF23I7N sa pamamagitan ng Intel at EP4CGX110CF23I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF23I7N | EP4CGX110CF23I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | 66 |
| Transceivers | Up to 3.125 Gbps embedded transceivers | 8 channels up to 3.125 Gbps |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | 7 | — |
| Packhaging | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-pin FBGA (F23) |
| Package Code | BGA (FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Logic Elements (LE) | — | 109,424 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory Bits | — | 5,621,760 bits |
| M9K Memory Blocks | — | [DATA_NEEDED: M9K block count] |
| User I/O | — | 270 |
| PLLs | — | 8 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Lead-Free | — | Yes |