EP4CGX110DF23I7N vs EP4CGX50DF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF23I7N sa pamamagitan ng Intel at EP4CGX50DF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF23I7N | EP4CGX50DF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 2,562 Kbit |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| Speed Grade | 7 | I7 |
| Packhaging | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-ball FBGA (BGA-484) |
| Package Code | BGA (FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Series | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Number of Logic Cells | — | 49,888 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum User I/O Pins | — | 290 |
| Number of Transceivers | — | 8 (3.125 Gbps) |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.00 mm |
| Operating Temperature (Industrial) | — | -40 C to +100 C |
| Number of PLLs | — | 4 |