EP4CGX110DF27C7 vs EP4CGX110DF27I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF27C7 sa pamamagitan ng Intel at EP4CGX110DF27I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF27C7 | EP4CGX110DF27I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Logic Elements (LE) | 109,424 | — |
| Embedded Memory Bits | 5,621,760 | — |
| Maximum User I/O | 393 | — |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Transceiver Channels | 8 | 8 |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | C7 | 8 |
| Temperature na Operasyon | 0 C to +85 C (Commercial) | — |
| Packhaging | 672-ball FBGA (F27), 27 mm | 672-pin FBGA (F27) |
| Process Node | 60 nm low-power | — |
| Configuration Methods | AS, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 109,424 |
| Process Technology | — | 60 nm low-k |
| Core Voltage | — | 1.2 V |
| Embedded Memory (RAM) | — | 4,608 Kbits |
| Embedded Multipliers (18x18) | — | 280 |
| Maximum User I/O Pins | — | 433 |
| User I/O Banks | — | 8 |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| Hard IP | — | PCI Express Gen1 (x1/x2) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |