EP4CGX110DF31C8N vs EP4CGX110DF31I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF31C8N sa pamamagitan ng Intel at EP4CGX110DF31I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX110DF31C8N EP4CGX110DF31I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV GX Cyclone IV GX
Logic Elements 109,424 —
Logic Array Blocks (LABs) 6,839 —
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) —
Embedded Memory Blocks M9K blocks, 9-bit parity —
DSP Blocks (18x18 Multipliers) 264 multipliers —
Maximum User I/Os 475 —
I/O Banks 8 —
PLLs 4 general-purpose PLLs —
Transceivers 8 high-speed transceivers up to 3.125 Gbps Up to 8 channels, 3.125 Gbps
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 —
Core Supply Voltage 1.2 V 1.2 V
Process Technology 60 nm low-power CMOS 60 nm low-power CMOS
Packhaging 896-ball FineLine BGA (F31), 31 mm FBGA-896 (31x31 mm)
Operating Temperature (Commercial) 0C to 85C —
Speed Grade 8 —
Configuration SRAM-based, supports AS, PS, JTAG, FPP —
Tindminan RoHS Compliant Compliant
Logic Elements (LE) — 109,424
Logic Blocks / ALMs — 47 (ALM-adaptive logic modules)
Embedded Memory — 5,621,760 bits (5.49 Mbit)
Embedded Multipliers — 270 (18x18)
User I/Os — 475
PCIe Hard IP — Yes, Gen1 (x1/x2/x4)
Uri ng Pagpapasok — Surface Mount
Temperature na Operasyon — -40C to +100C (Industrial)
Packaging — Tray
Configuration Modes — JTAG, AS, PS, FPP

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