EP4CGX50CF23C7N vs EP4CGX50CF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23C7N sa pamamagitan ng Intel at EP4CGX50CF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23C7N | EP4CGX50CF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | — |
| Logic Elements (LE) | 49,888 | 49,888 |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Packhaging | 484-FBGA (F23, 23 x 23 mm) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | C7 (commercial) | — |
| Temperature na Operasyon | -40C to +85C (commercial) | -40C to +100C (industrial, I7) |
| Process Technology | 60 nm TSMC low-power | — |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | AS, PS, JTAG |
| Tindminan RoHS | Compliant (lead-free) | Compliant (lead-free N suffix) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Device Family | — | Cyclone IV GX |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Embedded Memory Bits | — | 2,562,048 |
| Maximum User I/O | — | 290 |
| Transceivers | — | 8 channels, up to 3.125 Gbps |
| Core Supply Voltage | — | 1.2 V |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |