EP4CGX50DF27C6N vs EP4CGX50DF27C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27C6N sa pamamagitan ng Intel at EP4CGX50DF27C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50DF27C6N | EP4CGX50DF27C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone IV GX | — |
| Logic Elements (LE) | 49,888 | — |
| Logic Array Blocks (LAB) | 3,118 | — |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | 8 channels up to 3.125 Gbps |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C6 (commercial) | C7 (commercial) |
| Process Technology | 60 nm low-power | 60 nm |
| Packhaging | 672-ball FineLine BGA (FBGA) | 672-ball FBGA (F27) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FBGA) |
| Tindminan RoHS | Compliant | Compliant |
| Device Family | — | Cyclone IV GX |
| Logic Elements | — | 49,888 |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 |
| Total RAM Bits | — | 2,562,048 (256 K x 8 / 32 K x 36 typical) |
| User I/O | — | 310 |
| Pins / Balls | — | 672 |
| Level ng MSL | — | 3 (168 hours) |
| Multipliers (DSP blocks) | — | [DATA_NEEDED: dedicated hardware multiplier count] |