EP4SGX360FF35C2X vs EP4SGX360FF35C2XN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35C2X sa pamamagitan ng Intel at EP4SGX360FF35C2XN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX360FF35C2X EP4SGX360FF35C2XN
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Stratix IV GX Stratix IV GX
Logic Elements 353,600 353,600
Adaptive Logic Modules (LABs) 14,144 —
Embedded Memory 23,105,536 bits —
User I/O Pins 564 —
Number of Transceivers 24 24
Max Transceiver Data Rate 8.5 Gbps —
DSP Blocks (18x18 multipliers) 1,288 —
Global Clock Networks 32 —
Process Node 40 nm CMOS —
Packhaging 1152-ball FCBGA (FF35), 35 x 35 mm, 1.0 mm pitch 1152-BBGA, FCBGA (Flip-Chip BGA)
Speed Grade C2 (fastest) -2
Temperature ng Junction na Operasyon 0 °C to +85 °C (commercial) —
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant Compliant
Lead-Free Yes Yes
Design Software Quartus II —
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 14,144
Embedded Memory (bits) — 23,105,536
Number of Logic Elements/Cells — 353,600
Total RAM Bits — 23,105,536
Number of I/O — 564
User I/O Banks — 12
Supply Voltage - Core — 0.9 V
Transceiver Data Rate (max) — 8.5 Gbps
DSP Multipliers (18x18) — 1,920 (estimated per family datasheet)
Process Technology — 40 nm TSMC
Temperature na Operasyon — 0C to +85C (Commercial)

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