EP4SGX360FF35I3 vs EP4SGX360FF35C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35I3 sa pamamagitan ng Intel at EP4SGX360FF35C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360FF35I3 | EP4SGX360FF35C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Temperature na Operasyon | -40C to +100C | 0C to +85C (commercial) |
| Packhaging | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (FF35, 35 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | I3 | C3 |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Level ng MSL | [DATA_NEEDED: MSL] | — |
| Number of Logic Elements | — | 353,600 |
| Number of LABs/CLBs | — | 14,144 |
| Number of User I/O | — | 564 |
| Core Voltage Supply | — | 0.87 V to 0.93 V |
| Supply Voltage Range | — | 0.87 V to 0.93 V (core) |
| Transceivers | — | Up to 24 channels at up to 8.5 Gbps |
| DSP Blocks | — | 48 (18x18 multipliers) |
| Lead-Free | — | Yes |