EP4SGX360FF35I3N vs EP4SGX360FF35C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35I3N sa pamamagitan ng Intel at EP4SGX360FF35C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FF35I3N - Stratix IV GX 360K LE FPGA | Intel | 1152-FBGA
EP4SGX360FF35I3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360FF35I3N | EP4SGX360FF35C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 | 353,600 |
| Adaptive Logic Modules (ALM) | 141,440 | — |
| Embedded Memory (Bits) | 23,105,536 | — |
| Total RAM Blocks | 564 (M20K blocks) | — |
| User I/O Count | 564 | — |
| Number of LABs/CLBs | 14144 | — |
| Packhaging | 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) | 1152-FBGA (35x35 mm), FCBGA |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) | — |
| Supply Voltage Core | 0.95 V (typical) | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Process Node | 40 nm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Array Blocks (LAB) | — | 14,144 |
| Embedded Memory | — | 23,105,536 bits |
| User I/O Pins | — | 564 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V (0.87 V to 0.93 V) |
| Temperature ng Junction na Operasyon | — | 0 C to 85 C |
| Grade | — | Commercial |
| Speed/Package Grade | — | FF35 |
| Uri ng Memory | — | TriMatrix (MLAB + M9K + M144K blocks) |
| DSP Blocks | — | Yes (dedicated) |
| Hard Memory Controller | — | DDR/DDR2/DDR3, QDRII+, RLDRAM II |
| Lead-Free | — | Yes |