EP4SGX360FH29C4N vs EP4SGX360FH29C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FH29C4N sa pamamagitan ng Intel at EP4SGX360FH29C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360FH29C4N | EP4SGX360FH29C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Temperature na Operasyon | 0C to 85C (commercial) | Commercial (0C to +85C) |
| Packhaging | 780-FCBGA, FC-HFBGA (FH29) | 780-FCBGA (HBGA-780), 33 x 33 mm |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 (mid-tier) | C3 |
| Number of Transceivers | 24 (up to 8.5 Gbps) | — |
| Embedded Multipliers (18x18) | 1,288 | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| Tindminan RoHS | Compliant / Lead-free | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 14144 LABs |
| Maximum User I/Os | — | 289 |
| Embedded Memory | — | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | — | Up to 1,040 |
| Transceivers | — | Multi-gigabit serial transceivers (per device variant) |
| Memory Standards Supported | — | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | — | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |