EP4SGX360HF35C4N vs EP4SGX360HF35C2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360HF35C4N sa pamamagitan ng Intel at EP4SGX360HF35C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX360HF35C4N EP4SGX360HF35C2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Stratix IV GX Stratix IV GX FPGA
Logic Elements (LEs) 353,600 353,600
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Logic Array Blocks (LABs) 14,144 —
Embedded Memory (bits) 23,105,536 23,105,536
Memory Blocks M20K + M512 (per datasheet) —
Maximum User I/Os 564 —
Transceivers Up to 24 channels (per family datasheet) Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable)
Max Transceiver Data Rate 8.5 Gbps —
Process Technology 40 nm 40 nm
Core Voltage (Vcc) 0.9 V —
Packhaging 1152-ball FC-FBGA (HF35, 35x35 mm) —
Speed Grade C4 —
Temperature na Operasyon 0C to +85C (Commercial) 0C to +85C (commercial)
RoHS / Lead-Free Yes (RoHS compliant, lead-free) —
Hard IP Blocks PCIe Gen1/Gen2, 8B/10B encoder/decoder, memory controllers —
Design Tool Quartus II / Quartus Prime Quartus II / Quartus Prime
Series — Stratix IV GX
LABs/CLBs — 14,144
Number of I/O — 564 (max 532 user I/O)
Number of Logic Cells — 353,600
Core Voltage — 0.9 V
Package Type — 1152-pin FC-FBGA
Package Code — HF35 (35x35 mm, 1.0 mm pitch)
Uri ng Pagpapasok — Surface Mount (Flip-Chip BGA)
Tindminan RoHS — Compliant
Configuration — JTAG / Active Serial (external config device)

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