EP4SGX360KF40C2 vs EP4SGX360KF40I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360KF40C2 sa pamamagitan ng Intel at EP4SGX360KF40I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360KF40I3 - Stratix IV GX FPGA, 353600 LEs, 1517-FCBGA | Intel
EP4SGX360KF40I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP4SGX360KF40C2 | EP4SGX360KF40I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm TSMC |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | 48-bit variable-precision multipliers |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | I3 (industrial performance grade) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Packhaging | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FCBGA (FC-FBGA) |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | EP4SGX360 |
| Logic Elements (LEs) | — | 353600 |
| Embedded Memory | — | 23105536 bits (approx 17.5 Mbits / 22838 Kb) |
| Maximum User I/Os | — | 744 |
| Transceivers | — | 24 channels (up to 8.5 Gbps) |
| Lead-Free | — | Yes |
| Design Software | — | Quartus II (legacy) / Quartus Prime |