EP4SGX360NF45C2N vs EP4SGX360NF45I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360NF45C2N sa pamamagitan ng Intel at EP4SGX360NF45I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360NF45C2N - Stratix IV GX FPGA 353K LEs | Intel | FBGA-1932
EP4SGX360NF45C2N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360NF45C2N | EP4SGX360NF45I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | TSMC 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | I3 |
| Temperature na Operasyon | 0C to 85C (commercial, N suffix in legacy Altera marking) | -40C to +100C (Industrial) |
| Packhaging | 1932-ball FC-FBGA | 1932-ball FC-BGA (NF45) |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | — |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Logic Elements (LE) | — | 353,600 |
| Adaptive Logic Modules (ALM) | — | 141,440 |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/O | — | 920 |
| Core Voltage (VCC) | — | 0.9 V |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Transceiver Count | — | 24 (GX) |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.0 mm |
| RoHS Compliance | — | Yes (lead-free) |