EP4SGX530KH40C3 vs EP4SGX530KH40I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX530KH40C3 sa pamamagitan ng Intel at EP4SGX530KH40I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX530KH40C3 | EP4SGX530KH40I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix IV GX | — |
| Logic Elements | 531,200 | — |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | Up to 24 channels |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Series | — | Stratix IV GX |
| Manufacturer | — | Intel (formerly Altera) |
| Process Technology | — | TSMC 40 nm |
| Logic Elements (LEs) | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Total Embedded Memory | — | 28,033,024 bits (28 Mb) |
| Number of LABs/CLBs | — | 21,248 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Maximum User I/Os | — | 744 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (I3) |