EP4SGX70HF35I3G vs EP4SGX70HF35C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70HF35I3G sa pamamagitan ng Intel at EP4SGX70HF35C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX70HF35I3G | EP4SGX70HF35C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 LE | 72,600 |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Supply Voltage | 950 mV | 0.87 V to 0.93 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | HF35 |
| Packhaging | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Packaging | Tray | — |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |