EPF10K100ARI240-3N vs EPF10K100EBC356-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100ARI240-3N sa pamamagitan ng Intel at EPF10K100EBC356-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100ARI240-3N - 100K-Gate FLEX 10KA FPGA, 240-RQFP | Intel
EPF10K100ARI240-3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K100ARI240-3N | EPF10K100EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | FLEX 10KA | — |
| Logic Elements / Cells | 4,992 | — |
| Typical Gate Count | 100,000 gates | — |
| Embedded RAM Bits | 24,576 bits | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| User I/Os | 189 | — |
| Packhaging | 240-RQFP Exposed Pad (32x32 mm) | — |
| Pins | 240 | — |
| Propagation Delay (tpd) | 0.6 ns | — |
| Maximum Internal Frequency | 125 MHz | — |
| Process Technology | 0.30 µm CMOS SRAM | — |
| Supply Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | 0 C to +70 C (Commercial) |
| Speed Grade | -3N (industrial) | -1X |
| Uri ng Pagpapasok | Surface Mount (RQFP, gull-wing) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | FLEX 10KE |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 274 |
| Propagation Delay | — | 0.6 ns |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |