EPF10K100EFC484-3N vs EPF10K100EFI484-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFC484-3N sa pamamagitan ng Intel at EPF10K100EFI484-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EFC484-3N EPF10K100EFI484-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family FLEX 10KE FLEX 10KE
Logic Elements / Cells 4992 4,992
Total Gates 100,000 —
Embedded Memory (EAB) 49,152 bits (12 EABs) —
Logic Array Blocks (LABs) 624 624
User I/Os 338 338
Process Technology 0.22 µm CMOS 0.25 µm CMOS SRAM
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) —
Internal Performance 200 MHz —
Speed Grade -3 (fastest commercial bin) —
Packhaging 484-ball FineLine BGA (FC484 / FBGA-484) 484-FBGA (FineLine BGA)
Temperature Grade Commercial (0 °C to +70 °C) —
Configuration Method SRAM (external EPROM/Flash/JTAG required at power-up) —
Lead-Free / RoHS Yes (N suffix = lead-free) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Series — FLEX 10KE
Manufacturer — Intel (formerly Altera)
Total System Gates — 100,000
Embedded Memory (bits) — 49,152
Number of I/O Banks — [DATA_NEEDED: I/O banks]
Temperature na Operasyon — 0 °C to +70 °C
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 3.3 V
Propagation Delay — 0.6 ns
Maximum Frequency — 250 MHz
Programming Method — SRAM (in-system reconfigurable)
JTAG Support — Yes (IEEE 1149.1 boundary scan)
Tindminan RoHS — Compliant

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