EPF10K130EFC484-1 vs EPF10K130EFC484-3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC484-1 sa pamamagitan ng Intel at EPF10K130EFC484-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K130EFC484-1 - FLEX-10KE FPGA 130K Gates 484-BGA | Intel / Altera
EPF10K130EFC484-1 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC484-1 | EPF10K130EFC484-3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Presyo ng Yunit (USD) | $92.00 | — |
| Series | FLEX-10KE | FLEX-10KE |
| Family | FLEX-10KE | — |
| Typical Gates | 130,000 | — |
| Logic Elements | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EAB) | 65,536 bits (64 Kbit) | — |
| User I/Os | 369 | — |
| Maximum Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant) | — |
| Logic Family | CMOS | — |
| Package Type | FineLine BGA-484 | 484-BBGA (FineLine BGA) |
| Package Dimensions | 23 x 23 mm | 23 x 23 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Temperature na Operasyon | 0C to +70C (Commercial) | — |
| Configuration Interface | JTAG (IEEE 1149.1 / IEEE 1532) | JTAG / PS / PPS / Altera serial |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 (slower commercial bin) | -3 (faster timing bin) |
| Number of Logic Elements / Cells | — | 6656 |
| Total RAM Bits | — | 65536 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Process Technology | — | 0.22 µm CMOS |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |