EPF10K130EFC672-2 vs EPF10K130EFC672-2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC672-2 sa pamamagitan ng Altera at EPF10K130EFC672-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC672-2 | EPF10K130EFC672-2X |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 10KE | — |
| Logic Elements / Cells | 6,656 | — |
| Total Gates | ~130,000 | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (RAM bits) | 65,536 | — |
| Maximum User I/Os | 413 | — |
| Number of I/O Pins | 672 (package pins) | — |
| Packhaging | 672-ball FineLine BGA | 672-FBGA (FineLine BGA, 27x27 mm) |
| Process Technology | 0.22 µm CMOS | 0.22 μm CMOS SRAM |
| Core Supply Voltage | 2.5 V | 2.5 V (2.375 V to 2.625 V) |
| Propagation Delay (typ.) | 0.6 ns | — |
| Internal Operating Frequency (max) | 333.33 MHz | — |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | 0C to +70C (commercial) |
| Speed Grade | -2 | — |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | FLEX 10KE |
| Number of Logic Elements (LEs) | — | 6656 |
| Number of Logic Array Blocks (LABs) | — | 832 |
| Total RAM Bits | — | 65536 |
| Number of User I/Os | — | 413 |
| Number of DLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| I/O Supply Voltage | — | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) |
| Configuration Method | — | Serial configuration device, JTAG |
| Logic Family | — | CMOS, SRAM-based |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |