EPF10K200EBI600-2 vs EPF10K200EBC600-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBI600-2 sa pamamagitan ng Intel at EPF10K200EBC600-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EBI600-2 EPF10K200EBC600-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE —
System Gates 200,000 —
Logic Elements (LEs) 9,984 —
Logic Array Blocks (LABs) 1,248 —
Embedded RAM 98,304 bits —
Embedded Array Blocks (EABs) 12 (typical for this density) —
User I/O Pins 470 —
Supply Voltage (VCCINT) 2.5 V —
Propagation Delay 0.4 ns (per -2 speed grade) 0.4 ns
Temperature na Operasyon 0 C to 70 C (commercial) —
Packhaging BGA-600, 45 x 45 mm, 1.27 mm pitch 600-BGA
Logic Family CMOS, SRAM-based —
Uri ng Pagpapasok Surface Mount (BGA) —
Configuration Method JTAG / ByteBlaster (SRAM configuration) —
Tindminan RoHS Compliant (lead-free package) unknown
Product Type — Field Programmable Gate Array (FPGA)
Device Family — FLEX-10KE
Logic Elements — 9,984
Embedded Memory — 98,304 bits
Logic Array Blocks — 1,248 LABs
I/O Count — 470 I/O
Volte ng Pagbibigay — 2.5 V
Technology — Mixed CMOS
Commercial Temperature — 85 C
Embedded Array — Enhanced embedded array
Memory Feature — Dual-port memory
Configuration Interface — [DATA_NEEDED: configuration interface]
Package Dimensions — [DATA_NEEDED: package dimensions]
Operating Current — [DATA_NEEDED: operating current]
Pinout — [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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