EPF10K200EFC672-2 vs EPF10K200EFC672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EFC672-2 sa pamamagitan ng Intel at EPF10K200EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EFC672-2 EPF10K200EFC672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX 10KE —
Logic Elements 9,984 —
Typical Gates 200,000 —
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 —
Logic Array Blocks (LABs) 624 —
Packhaging 672-BBGA (FineLine BGA) —
Package Dimensions 45 x 45 mm —
Ball Pitch 1.27 mm —
Process Technology 0.22 um CMOS 0.22 µm CMOS
Speed Grade -2 —
Propagation Delay 0.4 ns 0.4 ns
Temperature na Operasyon 0 C to 70 C 0 °C to +70 °C (commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
Tindminan RoHS Compliant (per distributor listing) [DATA_NEEDED: rohs status]
Logic Family CMOS —
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Packhaging / Kaso — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Uri ng Pagpapasok — Surface Mount
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
Level ng MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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