EPF10K200EGC599-1 vs EPF10K200EBC600-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EGC599-1 sa pamamagitan ng Intel at EPF10K200EBC600-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EGC599-1 EPF10K200EBC600-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family FLEX 10KE —
Logic Elements (LEs) 9,984 —
Typical Gates 200,000 —
Embedded Array Blocks (EABs) 470 —
Total RAM Bits 98,304 —
Core Supply Voltage 2.375 V to 2.625 V —
I/O Voltage Tolerance 5.0 V tolerant —
Bilang ng Pin 599 —
Package Type 599-BCPGA (Ceramic Pin Grid Array) —
Package Dimensions 62.48 x 62.48 mm [DATA_NEEDED: package dimensions]
Uri ng Pagpapasok Through-Hole (Socket or Solder) —
Temperature na Operasyon 0C to +70C (Commercial) —
Programming Interface JTAG (IEEE 1149.1) —
PLLs 4 —
Tindminan RoHS [DATA_NEEDED: RoHS status of ceramic CPGA variant] unknown
Product Type — Field Programmable Gate Array (FPGA)
Device Family — FLEX-10KE
Logic Elements — 9,984
Embedded Memory — 98,304 bits
Logic Array Blocks — 1,248 LABs
I/O Count — 470 I/O
Volte ng Pagbibigay — 2.5 V
Packhaging — 600-BGA
Technology — Mixed CMOS
Commercial Temperature — 85 C
Propagation Delay — 0.4 ns
Embedded Array — Enhanced embedded array
Memory Feature — Dual-port memory
Configuration Interface — [DATA_NEEDED: configuration interface]
Operating Current — [DATA_NEEDED: operating current]
Pinout — [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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