EPF10K200SBC356-1X vs EPF10K200SBC356-2X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC356-1X sa pamamagitan ng Intel at EPF10K200SBC356-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EPF10K200SBC356-1X EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

EPF10K200SBC356-1X ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EPF10K200SBC356-1X EPF10K200SBC356-2X
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family FLEX 10KE FLEX 10K
Series FLEX-10KS FLEX-10KS
Typical System Gates 200,000 —
Maximum System Gates 513,000 —
Logic Elements (LEs) 9,984 —
Logic Array Blocks (LABs) 1,248 1248
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 39,616 —
User I/Os 274 —
Process Technology 0.22 µm CMOS CMOS 0.22 µm
Core Voltage (VCCINT) 2.5 V (2.375 V to 2.625 V) —
I/O Voltage (VCCIO) 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) —
Packhaging 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch 356-LBGA (35x35 mm, 1.27 mm pitch)
Operating Temperature Grade Commercial —
Speed Grade -1 (fastest commercial bin) -2
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
JTAG Support IEEE Std. 1149.1 boundary scan + ISP —
Lead Free / RoHS Yes (per -1X suffix) —
Configuration Mode SRAM-based, ISP via JTAG —
Logic Elements / Cells — 9984
Approximate Gate Count — 200,000
User I/O Count — 274
Volte ng Pagbibigay — 2.375 V to 2.625 V (core)
Propagation Delay (typ.) — 0.4 ns
Temperature na Operasyon — 0 °C to +70 °C (commercial)
Lead Free Status / RoHS — RoHS non-compliant (per third-party listing)
Configuration Method — SRAM-based, requires external configuration device (EPC2/EPC8)
In-System Programmability — Yes (via JTAG or serial interface)

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