EPF10K200SBC600-2 vs EPF10K100EBC356-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC600-2 sa pamamagitan ng Altera at EPF10K100EBC356-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200SBC600-2 | EPF10K100EBC356-2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Manufacturer | Altera (now Intel) | — |
| Series | FLEX-10KS | FLEX-10KE |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Typical Gates | 200,000 | 100,000 |
| User I/Os | 470 | — |
| Propagation Delay | 0.4 ns | — |
| Voltage - Supply (VCCINT) | 2.375 V to 2.625 V | — |
| Temperature na Operasyon | 0 C to 70 C | 0 C to 70 C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 600-BGA (45 x 45 mm, 1.27 mm pitch) | — |
| Supplier Device Package | 600-BGA | — |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.22 micrometer | CMOS, SRAM-based |
| Embedded Array Blocks (EABs) | Yes (for distributed RAM/ROM) | 12 |
| PLLs | 4 | — |
| Configuration Interface | IEEE 1149.1 JTAG | — |
| MultiVolt I/O | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) | — |
| Packaging | Bulk / Tray | — |
| Tindminan RoHS | Non-compliant | [DATA_NEEDED: RoHS compliance] |
| Family | — | Embedded Programmable Logic Device (PLD) |
| Maximum System Gates | — | 158,000 |
| Logic Elements (LEs) | — | 4,992 |
| Number of LABs/CLBs | — | 624 |
| Total RAM Bits | — | 49,152 |
| User I/O Pins | — | 274 |
| Supply Voltage (Core) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | — | 0.5 ns |
| Internal Operating Frequency | — | up to 250 MHz |
| Package Type | — | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Speed Grade | — | -2 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |