EPF10K200SBC600-2 vs EPF10K200EBC600-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC600-2 sa pamamagitan ng Altera at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SBC600-2 EPF10K200EBC600-2
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Manufacturer Altera (now Intel) —
Series FLEX-10KS FLEX-10KE
Logic Elements / Cells 9,984 —
Logic Array Blocks (LABs) 1,248 1248
Typical Gates 200,000 —
User I/Os 470 —
Propagation Delay 0.4 ns 0.4 ns
Voltage - Supply (VCCINT) 2.375 V to 2.625 V —
Temperature na Operasyon 0 C to 70 C 0°C to +70°C (Commercial)
Uri ng Pagpapasok Surface Mount Surface Mount
Packhaging / Kaso 600-BGA (45 x 45 mm, 1.27 mm pitch) —
Supplier Device Package 600-BGA —
Logic Family CMOS (SRAM-based) CMOS (SRAM-based)
Process Technology 0.22 micrometer 0.30 µm CMOS
Embedded Array Blocks (EABs) Yes (for distributed RAM/ROM) —
PLLs 4 —
Configuration Interface IEEE 1149.1 JTAG —
MultiVolt I/O Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) —
Packaging Bulk / Tray —
Tindminan RoHS Non-compliant unknown
Typical Gate Count — 200,000 gates
Logic Elements (LEs) — 9984
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
Volte ng Pagbibigay — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete

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