EPF10K200SBC600-2 vs EPF10K200SFI672-2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC600-2 sa pamamagitan ng Altera at EPF10K200SFI672-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SBC600-2 EPF10K200SFI672-2N
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Manufacturer Altera (now Intel) —
Series FLEX-10KS —
Logic Elements / Cells 9,984 —
Logic Array Blocks (LABs) 1,248 —
Typical Gates 200,000 200,000
User I/Os 470 470
Propagation Delay 0.4 ns —
Voltage - Supply (VCCINT) 2.375 V to 2.625 V —
Temperature na Operasyon 0 C to 70 C —
Uri ng Pagpapasok Surface Mount Surface Mount
Packhaging / Kaso 600-BGA (45 x 45 mm, 1.27 mm pitch) —
Supplier Device Package 600-BGA —
Logic Family CMOS (SRAM-based) —
Process Technology 0.22 micrometer 0.22 um CMOS
Embedded Array Blocks (EABs) Yes (for distributed RAM/ROM) —
PLLs 4 —
Configuration Interface IEEE 1149.1 JTAG —
MultiVolt I/O Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) —
Packaging Bulk / Tray —
Tindminan RoHS Non-compliant Lead-free (N suffix)
Family — FLEX 10KE
Device Logic Elements — 9,984
Maximum System Gates — [DATA_NEEDED: maximum system gates]
Embedded Memory (EAB) — 12 EABs, 98,304 bits total
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 3.3 V (5.0 V tolerant)
Operating Temperature Grade — Industrial (-40C to +85C)
Speed Grade — -2 (mid)
Packhaging — 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch
JTAG Boundary-Scan — IEEE Std. 1149.1 compliant
Configuration Method — SRAM-based (requires external boot ROM)

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