EPF10K200SFC484-2N vs EPF10K200SFC484-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFC484-2N sa pamamagitan ng Intel at EPF10K200SFC484-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SFC484-2N EPF10K200SFC484-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10K
Logic Elements / Cells 9,984 —
Gate Count 200,000 —
Logic Array Blocks (LABs) 1,248 1,248
Embedded RAM Bits 98,304 (96 Kbit) —
User I/O Pins 369 369
Number of I/Os (alt spec) 470 (per digchip datasheet summary) —
Core Supply Voltage 2.375 V to 2.625 V (2.5 V nominal) —
Internal Performance 200 MHz —
Propagation Delay 0.4 ns —
Process Technology 0.22 µm CMOS 0.22 µm CMOS SRAM
Temperature na Operasyon 0°C to 70°C (Commercial) 0 °C to +70 °C (Commercial)
Packhaging 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch 484-Ball FineLine BGA (PBGA484)
Uri ng Pagpapasok Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1), SRAM configuration —
I/O Standard Support 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V) —
Logic Family CMOS —
Compliance / Lead Status [DATA_NEEDED: RoHS status] —
Series — FLEX-10KS
System Gates — 200,000
Logic Cells — 9,984
Core Voltage — 2.375 V to 2.625 V
Maximum Internal Frequency — 166.67 MHz
Embedded Memory (RAM bits) — 40,960 (via EABs)
Global Clock Networks — 4
Package Dimensions — 23 mm × 23 mm, 1.0 mm pitch
Configuration Method — SRAM, JTAG, EPC2 PROM
I/O Standards — 3.3 V LVTTL/LVCMOS, 5.0 V PCI
Tindminan RoHS — [DATA_NEEDED: RoHS status]
Status — Obsolete (last shipped 2007-2010, available via brokers)

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