EPF10K200SFI672-2 vs EPF10K200EFC672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFI672-2 sa pamamagitan ng Intel at EPF10K200EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SFI672-2 EPF10K200EFC672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE —
Logic Elements 9984 —
System Gates 200000 —
Logic Array Blocks (LABs) 1248 —
User I/Os 470 —
Embedded Array Blocks (EABs) 24 —
Embedded Memory (EAB SRAM) 96 Kbit —
Distributed Memory 98304 bits —
Process Technology 0.22 µm (Arrow lists 0.42 µm) 0.22 µm CMOS
Core Supply Voltage 2.5 V —
Packhaging 672-pin FineLine BGA (FBGA) —
Speed Grade -2 —
Temperature na Operasyon Industrial (-40C to +85C) 0 °C to +70 °C (commercial)
JTAG Boundary Scan IEEE Std. 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade —
Programming SRAM-based, in-system programmable —
Tindminan RoHS Not compliant (per Arrow EU RoHS listing) [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Packhaging / Kaso — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Uri ng Pagpapasok — Surface Mount
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
Level ng MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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