EPF10K200SRC240-2 vs EPF10K200SRC240-3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SRC240-2 sa pamamagitan ng Intel at EPF10K200SRC240-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200SRC240-2 | EPF10K200SRC240-3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KS | — |
| Family | FLEX 10KS (FLEX 10KE/10KA generation) | FLEX 10KE |
| Number of Logic Elements (LEs) | 9984 | — |
| Number of Logic Array Blocks (LABs) | 1248 | — |
| Total RAM Bits | 98304 | — |
| Number of User I/Os | 182 | — |
| Number of Gates | 513000 | — |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) | 2.5 V |
| Temperature na Operasyon | 0C to +70C (Commercial, TA) | 0 °C to +70 °C (Commercial) |
| Packhaging / Kaso | 240-BFQFP Exposed Pad (240-RQFP, 32x32 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 240 | — |
| Speed Grade | -2 (~80 MHz internal, typical) | -3 (commercial) |
| Configuration Interface | IEEE 1149.1 JTAG + Altera EPC EEPROM | — |
| Process Technology | 0.42 micrometer CMOS SRAM | 0.22 µm CMOS SRAM |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Typical System Gates | — | 200,000 |
| Logic Elements (LEs) | — | 9,984 |
| Maximum Logic Elements | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 24 |
| Maximum User RAM Bits | — | 98,304 |
| Logic Array Blocks (LABs) | — | 1,248 |
| User I/Os | — | 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions |
| Propagation Delay (tPD) | — | 0.40 ns |
| Internal Operating Frequency | — | 166.67 MHz |
| MultiVolt I/O Support | — | 2.5 V and 3.3 V interfaces |
| Packhaging | — | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic) |
| Configuration Method | — | SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading |