EPF10K20RC240-3 vs EPF10K200SRC240-3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K20RC240-3 sa pamamagitan ng Intel at EPF10K200SRC240-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K20RC240-3 EPF10K200SRC240-3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX 10K FLEX 10KE
Series FLEX-10K® —
Typical Gates 20,000 —
Logic Elements (LEs) 12,288 9,984
Logic Array Blocks (LABs) 189 1,248
Flip-Flops 1,152 —
Embedded Array Blocks (EABs) 6 (2 Kbit each) 24
Total EAB RAM 12 Kbits —
User I/Os 470 (max per package) 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions
Packhaging 240-BFQFP Exposed Pad (RQFP-240) 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch
Process Technology 0.42 µm CMOS, 5 metal layers 0.22 µm CMOS SRAM
Core Supply Voltage (VCCINT) 5 V —
I/O Supply Voltage (VCCIO) 3.3 V or 5 V tolerant —
Propagation Delay (tpd) 0.4 ns —
Maximum Internal Frequency 125 MHz —
Temperature na Operasyon 0 °C to +70 °C (Commercial) 0 °C to +70 °C (Commercial)
Speed Grade -3 -3 (commercial)
Configuration Interface JTAG (IEEE 1149.1) + serial configuration PROM —
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS unknown (legacy Altera part, likely non-RoHS) [DATA_NEEDED: RoHS status]
Programming SRAM-based, in-system reconfigurable —
Typical System Gates — 200,000
Maximum Logic Elements — 9,984
Maximum User RAM Bits — 98,304
Propagation Delay (tPD) — 0.40 ns
Internal Operating Frequency — 166.67 MHz
Core Supply Voltage — 2.5 V
MultiVolt I/O Support — 2.5 V and 3.3 V interfaces
JTAG Support — IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic)
Configuration Method — SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading

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