EPF10K250EBI600-3 vs EPF10K200EBC600-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBI600-3 sa pamamagitan ng Intel at EPF10K200EBC600-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EPF10K250EBI600-3 EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EPF10K250EBI600-3 EPF10K200EBC600-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 12,160 —
Typical Gate Count 250,000 system gates —
Embedded System Blocks (ESBs) 12 —
Maximum User I/O 470 470
Dedicated Inputs 4 —
PLLs 4 —
On-chip RAM Up to 40 Kbits —
Packhaging 600-ball BGA (HBGA) 600-ball FineLine BGA, 45 x 45 mm
Ball Pitch 1.93 mm —
Core Voltage 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] 2.5 V (2.375 V to 2.625 V)
Temperature na Operasyon Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] 0C to +70C (commercial)
Speed Grade -3 (fastest) -3 (commercial)
Process Technology 0.22 µm CMOS, 4-layer metal 0.22 micrometer SRAM
Configuration Method SRAM, requires external configuration device (EPC series) —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Not specified (SnPb / tin-lead finish per legacy distributor listing) [DATA_NEEDED: RoHS compliance status]
Lead-free no (legacy tin-lead per distributor description) —
Series — FLEX-10KE
System Gates — 200,000
Logic Elements / Cells — 9,984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EABs) — 24,576 bits
Number of PLLs — 4
JTAG Support — Yes (IEEE 1149.1 boundary-scan)

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