EPF10K30EFC256-1X vs EPF10K30EFC256-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-1X sa pamamagitan ng Intel at EPF10K30EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K30EFC256-1X EPF10K30EFC256-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 1728 —
Typical Gates 30,000 30,000
Logic Array Blocks (LABs) 216 216
Embedded Memory (EAB RAM) 24,576 bits (6 EABs of 4 Kbit each) —
User I/O 176 —
Maximum Internal Frequency 250 MHz —
Propagation Delay (tpd) 0.4 ns to 0.6 ns —
Process Technology 0.22 µm CMOS 0.22 micrometer CMOS
Core Supply Voltage 2.5 V —
MultiVolt I/O Support 2.5 V / 3.3 V / 5 V —
Packhaging 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) 256-ball FineLine BGA
Speed Grade -1X (fastest commercial) -3 (fastest)
Temperature na Operasyon 0 °C to +70 °C (commercial) —
Configuration Method SRAM, JTAG (IEEE 1149.1) —
Phase-Locked Loops 4 —
Compliance RoHS (check distributor for specific lot), Pb-free option available —
Logic Elements / Cells — 1,728
Embedded RAM Bits — 24,576
User I/O Pins — 176
Maximum Operating Frequency — 200 MHz
Core Supply Voltage (VCCINT) — 2.5 V
I/O Supply Voltage (VCCIO) — 3.3 V (multi-voltage I/O standard support)
Uri ng Pagpapasok — Surface Mount (BGA)
Temperature Grade — Commercial
Configuration Interface — Serial (EPC8/EPC16) and JTAG (IEEE 1149.1)
Tindminan RoHS — [DATA_NEEDED: RoHS status]

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