EPF10K30EQC208-1 vs EPF10K30EQC208-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EQC208-1 sa pamamagitan ng Intel at EPF10K30EQC208-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K30EQC208-1 | EPF10K30EQC208-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KE | — |
| Family | FLEX 10K | FLEX 10KE |
| Logic Elements / Cells | 1,728 | — |
| Total Gates | 30,000 (typical), 119,000 (maximum) | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) | 6 (24 Kbits total) |
| Total RAM Bits | 24,576 | — |
| User I/Os | 147 | — |
| Core Voltage | 2.5 V (2.375 V–2.625 V) | — |
| I/O Voltage | 5.0 V tolerant | — |
| Process Technology | 0.30 µm CMOS SRAM | 0.22 µm CMOS |
| Internal Frequency | 80 MHz (max) | — |
| Packhaging | 208-BQFP (PQFP) 28×28 mm | 208-pin PQFP (Plastic Quad Flat Pack) |
| Uri ng Pagpapasok | Surface Mount (Gull-Wing) | Surface Mount (gull-wing leads) |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | Commercial (0 °C to +70 °C) |
| Propagation Delay | 0.6 ns (typ) | — |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) | — |
| Tindminan RoHS | Not RoHS compliant (SnPb lead finish on BQFP) | Non-compliant (legacy PQFP package) |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Embedded Memory (bits) | — | 24,576 |
| Maximum User I/O | — | 147 |
| Core Supply Voltage | — | 2.5 V |
| Speed Grade | — | -2 |
| Package Dimensions | — | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | — | 200 MHz |
| Programmability | — | SRAM-based, JTAG/ISP |