EPF10K30ETI144-3 vs EPF10K30ETC144-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30ETI144-3 sa pamamagitan ng Altera at EPF10K30ETC144-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K30ETI144-3 | EPF10K30ETC144-2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX-10KE Embedded Programmable Logic Device | FLEX 10KE |
| Logic Elements | 1728 | 1,728 |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded RAM | 24,576 bits | — |
| Embedded Array Blocks (EABs) | 6 | 6 |
| Maximum User I/O | 102 | — |
| Maximum Equivalent Gates | 119,000 | — |
| Pin-to-Pin Delay (Speed Grade) | 12.5 ns | — |
| Supply Voltage (Core) | 2.5 V / 3.3 V | — |
| I/O Voltage Tolerance | 5.0 V / 3.3 V / 2.5 V (multi-volt) | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | 0C to +70C (Commercial) |
| Packhaging | 144-LQFP (LFQFP) | 144-LQFP (TQFP, 20x20 mm) |
| Package Height | 1.6 mm | — |
| Lead Finish | Tin/Lead (Sn/Pb) | — |
| Uri ng Pagpapasok | Surface Mount (Gull Wing) | Surface Mount |
| Configuration Method | SRAM (volatile) + JTAG IEEE 1149.1 | SRAM, JTAG (IEEE 1149.1) |
| Tindminan RoHS | Non-Compliant (Sn/Pb lead finish) | Compliant (lead-free) |
| Typical Gates | — | 30,000 |
| Maximum User I/Os | — | 102 |
| Embedded Memory Bits | — | 24,576 |
| Speed Grade | — | -2 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Internal Frequency | — | up to 80 MHz |
| Propagation Delay (typ.) | — | 0.6 ns |
| Process Technology | — | CMOS, SRAM-based |