EPF10K50EFC256-3 vs EPF10K30EFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K50EFC256-3 sa pamamagitan ng Intel at EPF10K30EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K50EFC256-3 - 50K Gates FLEX 10KE FPGA, 256-BGA | Intel / Altera
EPF10K50EFC256-3 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EPF10K50EFC256-3 | EPF10K30EFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 2880 | 1,728 |
| Typical Gates | 50,000 | 30,000 |
| Logic Array Blocks (LABs) | 360 | 216 |
| Embedded Array Blocks (EABs) | 10 | — |
| Total Embedded Memory | 40,960 bits | — |
| Maximum User I/Os | 191 | — |
| Packhaging | 256-pin FineLine BGA (FBGA-256) | 256-ball FineLine BGA |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Tolerance | 5.0 V (MultiVolt I/O interface) | — |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.22 micrometer CMOS |
| Internal Frequency (max) | 166.67 MHz | — |
| Propagation Delay (typical) | 0.6 ns | — |
| Speed Grade | -3 | -3 (fastest) |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | — |
| JTAG Support | IEEE Std. 1149.1 Boundary-Scan | — |
| Programming Method | In-system SRAM, JTAG or EPC configuration device | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Embedded RAM Bits | — | 24,576 |
| User I/O Pins | — | 176 |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V (multi-voltage I/O standard support) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Temperature Grade | — | Commercial |
| Configuration Interface | — | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |