EPF10K50STC144-3 vs EPF10K30ETI144-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K50STC144-3 sa pamamagitan ng Altera at EPF10K30ETI144-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K50STC144-3 | EPF10K30ETI144-3 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KS | FLEX-10KE |
| Family | FLEX 10K | FLEX-10KE Embedded Programmable Logic Device |
| Typical Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 216 |
| On-chip RAM Bits | 40,960 | — |
| Maximum User I/Os | 102 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Internal Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.6 ns (typical) | — |
| Speed Grade | -3 | — |
| Core Voltage | 2.5 V | — |
| I/O Voltage | 5.0 V (3.3 V LVTTL/LVCMOS compatible) | — |
| Process Technology | 0.22 um CMOS, SRAM-based | — |
| Packhaging | 144-LQFP (also called LFQFP / TQFP) | 144-LQFP (LFQFP) |
| Temperature na Operasyon | 0 C to 70 C (commercial) | -40C to +85C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (Gull-wing leads) | Surface Mount (Gull Wing) |
| Configuration | SRAM (volatile, requires external EPC) | — |
| JTAG Boundary Scan | Built-in, IEEE Std. 1149.1-1990 compliant | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (Sn/Pb lead finish) |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Embedded Array Blocks (EABs) | — | 6 |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |