EPF10K50VBI356-4 vs EPF10K50VBI356-3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K50VBI356-4 sa pamamagitan ng Intel at EPF10K50VBI356-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EPF10K50VBI356-3N EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EPF10K50VBI356-4 EPF10K50VBI356-3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Family FLEX 10K FLEX 10K
Logic Elements / Cells 2,880 2880
Typical Gates 50,000 —
Usable Gates 20,480 —
Logic Array Blocks (LABs) 360 —
Embedded Array Blocks (EABs) 16 —
Maximum User I/O 274 —
Internal Frequency 125 MHz —
Propagation Delay 0.6 ns —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Core Supply Voltage 3.3 V 3.3 V
Packhaging 356-ball LBGA —
Temperature na Operasyon 0 °C to 70 °C (Commercial) —
Configuration Method SRAM, in-system via JTAG —
Speed Grade -4 -3 (commercial/industrial timing)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Series — FLEX-10K®
Total RAM Bits — 20480
Number of LABs/CLBs — 360
Number of User I/O — 274
Number of Gates (typical) — 50000
Operating Temperature (industrial) — -40 °C to +85 °C
Package Type — 356-LBGA (Ball Grid Array, low-profile)
In-System Programmable — Yes (JTAG IEEE 1149.1)
Lead-Free (Pb-Free) — Yes (suffix "N")

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