EPF6016AFC256-3 vs EPF6010ATC144-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF6016AFC256-3 sa pamamagitan ng Intel at EPF6010ATC144-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF6016AFC256-3 | EPF6010ATC144-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 142.86 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | — |
| Bilang ng Pin | 256 | — |
| Speed Grade | -3 | -3 |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE Std 1149.1) / Serial |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| System Gates | — | 10,000 |
| Logic Elements / Logic Cells | — | 880 |
| Maximum User I/O | — | 102 |
| Supply Voltage - Operating | — | 3.0 V to 3.6 V |
| Configuration Memory | — | SRAM (volatile, re-programmable) |
| I/O Standards | — | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | — | 144-pin TQFP (Fine Line) |
| Pin Pitch | — | 0.5 mm |
| Operating Temperature Grade | — | Commercial / Industrial |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |