EPF8282ATI100-3S vs EPF8282ATC100-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF8282ATI100-3S sa pamamagitan ng Intel at EPF8282ATC100-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF8282ATI100-3S - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel / Altera
EPF8282ATI100-3S NrndPagsanggunian na paghahambing
| Parametro | EPF8282ATI100-3S | EPF8282ATC100-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | FLEX 8000 | FLEX 8000 |
| Device Logic Elements / Cells | 208 | — |
| Number of LABs/CLBs | 26 | — |
| Number of Logic Elements / Cells | 208 | — |
| Total RAM Bits | [DATA_NEEDED: embedded RAM bits] | — |
| Number of I/O | 78 | — |
| Number of Gates | 2500 | — |
| Voltage - Supply | 5 V | — |
| Temperature na Operasyon | -40C to +85C (industrial, I grade) | 0 °C to 70 °C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 100-TQFP | — |
| Supplier Device Package | 100-TQFP | — |
| Speed Grade | -3 | -2 |
| Maximum Toggle Frequency | 125 MHz | — |
| Architecture | SRAM-based, in-circuit reconfigurable (ICR) | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Process Technology | CMOS | 0.42 µm CMOS |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Usable Gates | — | 2,500 |
| Logic Cells | — | 208 |
| Logic Array Blocks (LABs) | — | 26 |
| User I/Os | — | 78 |
| Flip-Flops | — | 282 |
| Volte ng Pagbibigay | — | 5 V |
| Packhaging | — | 100-pin TQFP |
| Configuration Memory | — | SRAM (volatile, requires external boot) |
| Development Tool | — | Altera MAX+PLUS II |