EPF8282ATI100-3S vs EPF8282ATC100-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF8282ATI100-3S sa pamamagitan ng Intel at EPF8282ATC100-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF8282ATI100-3S EPF8282ATC100-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX 8000 FLEX 8000
Device Logic Elements / Cells 208 —
Number of LABs/CLBs 26 —
Number of Logic Elements / Cells 208 —
Total RAM Bits [DATA_NEEDED: embedded RAM bits] 12 Kbits
Number of I/O 78 —
Number of Gates 2500 —
Voltage - Supply 5 V —
Temperature na Operasyon -40C to +85C (industrial, I grade) —
Uri ng Pagpapasok Surface Mount —
Packhaging / Kaso 100-TQFP —
Supplier Device Package 100-TQFP —
Speed Grade -3 -3
Maximum Toggle Frequency 125 MHz —
Architecture SRAM-based, in-circuit reconfigurable (ICR) —
Boundary Scan IEEE 1149.1 (JTAG) JTAG IEEE 1149.1
Process Technology CMOS 0.42 micron CMOS SRAM
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] —
Logic Cells (LEs) — 208
Usable Gates — 2,500
Typical Gates Equivalent — 12,000
Maximum User I/O — 78
Number of Logic Array Blocks (LABs) — 26
Embedded Array Blocks (EABs) — 6
Supply Voltage (Core) — 5 V
MultiVolt I/O Support — 3.3 V / 5 V
Maximum Frequency — 125 MHz
Packhaging — 100-pin TQFP (100-TQFP)
Configuration Method — SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor
Operating Temperature (Commercial) — 0 C to +70 C
In-Circuit Reconfigurable — Yes (ICR)

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